Visitor Ticket Request (FREE)

9th Highly-functional Material Week 28th FINTECH JAPAN 18th Photonix 2018

For Visiting Enquiries


9:00 am - 6:00 pm
(Mon-Fri except national holidays)

Contact us by e-mail
  • Exhibitor's Product/Technology Seminar
  • Exhibitors' Press Releases

Packaging Film

Packaging Film


  1. Exhibition:
    9th Highly-functional FILM EXPO TOKYO
  2. Booth No: 18-22


  1. Feature Laminate Bags for Silicon Wafer Case Packaging
  2. Product Categories:
    Highly-functional Film Technology
    • Highly-functional Film
    • Functional Material

Other Products/Services:

  • Shin-Etsu Wrapping Films

    We applied the production technology that we developed for capacitor film, to produce our wrapping films. Shin-Etsu wrapping films are used in carbon ...

  • Shin-Etsu PP Films

We use cookies to operate this website and to improve its usability. Full details of what cookies are, why we use them and how you can manage them can be found by reading our Privacy & Cookies page. Please note that by using this site you are consenting to the use of cookies.